Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding

Pham, NgaNgaPhamCherman, VladimirVladimirChermanVandevelde, BartBartVandeveldeLimaye, PareshPareshLimayeTutunjyan, NinaNinaTutunjyanJansen, RoelofRoelofJansenVan Hoovels, NeleNeleVan HoovelsSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSoussan, PhilippePhilippeSoussanBeyne, EricEricBeyneTilmans, HarrieHarrieTilmans2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19572Zero-level packaging for (RF-)MEMS implementing TSVs and metal bondingProceedings paper