Salahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezVanstreels, KrisKrisVanstreelsPodpod, ArnitaArnitaPodpodPhommahaxay, AlainAlainPhommahaxayRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33927Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validationProceedings paperhttps://ieeexplore.ieee.org/document/8724578