Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

Armini, SilviaSilviaArminiWilson, ChrisChrisWilsonMoussa, AlainAlainMoussaFranquet, AlexisAlexisFranquetVanstreels, KrisKrisVanstreelsAtanasova, TanyaTanyaAtanasovaRadisic, AlexAlexRadisicCivale, YannYannCivaleRedolfi, AugustoAugustoRedolfiVan Ammel, AnnemieAnnemieVan AmmelEl-Mekki, ZaidZaidEl-MekkiBryce, GeorgeGeorgeBryceRuythooren, WouterWouterRuythooren2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16668Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVsProceedings paper