Maehara, MasatakaMasatakaMaeharaDerakhshandeh, JaberJaberDerakhshandehGerets, CarineCarineGeretsCochet, TomTomCochetCuypers, Dieter H.Dieter H.CuypersMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2025-04-162025-02-152025-04-162024979-8-3503-9037-72687-9700WOS:001340802800010https://imec-publications.be/handle/20.500.12860/45213IMC Assisted Die-bonding for Stacked Device IntegrationProceedings paper10.1109/ESTC60143.2024.10712004979-8-3503-9036-0WOS:001340802800010