In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

Liebens, MaartenMaartenLiebensJourdain, AnneAnneJourdainDe Vos, JoeriJoeriDe VosVandeweyer, TomTomVandeweyerMiller, AndyAndyMillerBeyne, EricEricBeyneLi, ShifangShifangLiBast, GerardGerardBastStoerring, MoritzMoritzStoerringHiebert, StephenStephenHiebertCross, AndrewAndrewCross2021-10-272021-10-2720190894-6507https://imec-publications.be/handle/20.500.12860/33448In-line metrology for characterization and control of extreme wafer thinning of bonded wafersJournal articlehttps://ieeexplore.ieee.org/document/8572790