Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging

Salahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezPodpod, ArnitaArnitaPodpodBeyne, EricEricBeyne2021-12-082021-11-022021-12-082020naWOS:000631824100062https://imec-publications.be/handle/20.500.12860/38045Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level PackagingProceedings paper978-1-7281-6293-5WOS:000631824100062DENSITY