Xu, BaohuiBaohuiXuChen, RongmeiRongmeiChenZhou, JiurenJiurenZhouLiang, JieJieLiang2023-12-072023-08-172023-12-0720230018-9383WOS:001043283700001https://imec-publications.be/handle/20.500.12860/42338A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer StructureJournal article10.1109/TED.2023.3297078WOS:001043283700001TEMPERATURE-COEFFICIENTPERFORMANCE ANALYSISCARBONSILICONINTERCONNECTSINTEGRATIONRESISTANCE