Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die

Labie, RietRietLabieBeyne, EricEricBeyneDegryse, DominiekDominiekDegryse2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7762Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k DieOral presentation