Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages

Chuang, Po-YaoPo-YaoChuangLorenzelli, FrancescoFrancescoLorenzelliChakravarty, SreejitSreejitChakravartyWu, Cheng-WenCheng-WenWuGielen, GeorgesGeorgesGielenMarinissen, Erik JanErik JanMarinissen2023-08-092023-07-242023-07-282023-08-0920231093-0167WOS:001011806600016https://imec-publications.be/handle/20.500.12860/42188Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die PackagesProceedings paper10.1109/VTS56346.2023.10140006979-8-3503-4630-5WOS:001011806600016