The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures

Dessein, KristofKristofDesseinAnil Kumar, P. S.P. S.Anil KumarNemeth, StefanStefanNemethDelaey, L.L.DelaeyBorghs, GustaafGustaafBorghsDe Boeck, JoJoDe Boeck2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4332The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructuresOral presentation