Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration

Luhn, OleOleLuhnRadisic, AlexAlexRadisicVereecken, PhilippePhilippeVereeckenVan Hoof, ChrisChrisVan HoofRuythooren, WouterWouterRuythoorenCelis, Jean-PierreJean-PierreCelis2021-10-182021-10-1820091099-0062https://imec-publications.be/handle/20.500.12860/15767Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential accelerationJournal article