Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask

Van Olmen, JanJanVan OlmenAl-Bayati, AAAl-BayatiBeyer, GeraldGeraldBeyerBoelen, PieterPieterBoelenCarbonell, LaureLaureCarbonellZhao, ChaoChaoZhaoCiofi, IvanIvanCiofiClaes, MartineMartineClaesCockburn, AndrewAndrewCockburnDruais, GaelGaelDruaisHendrickx, DirkDirkHendrickxHeylen, NancyNancyHeylenKesters, ElsElsKestersLytle, S.S.LytleNoori, A.A.NooriOp de Beeck, MaaikeMaaikeOp de BeeckStruyf, HerbertHerbertStruyfTokei, ZsoltZsoltTokeiVersluijs, JankoJankoVersluijs2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/13079Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmaskOral presentation