Gripping-in-liquid: handling challenges for automated ultra-thin wafer production

Giesen, TimTimGiesenMayer, P.P.MayerStiels, D.D.StielsWertz, R.R.WertzMartini, RobertoRobertoMartiniDebucquoy, MaartenMaartenDebucquoyVerl, A.A.Verl2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22400Gripping-in-liquid: handling challenges for automated ultra-thin wafer productionProceedings paper