TSV Cu plating and implications for CMP

Radisic, AlexAlexRadisicPhilipsen, HaroldHaroldPhilipsenHonore, MiaMiaHonoreWang, Y.S.Y.S.WangHeylen, NancyNancyHeylenEl-Mekki, ZaidZaidEl-MekkiArmini, SilviaSilviaArminiVandersmissen, KevinKevinVandersmissenRodet, SimonSimonRodetVan Ammel, AnnemieAnnemieVan AmmelBender, HugoHugoBenderDrijbooms, ChrisChrisDrijboomsVanstreels, KrisKrisVanstreelsRuythooren, WouterWouterRuythooren2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19643TSV Cu plating and implications for CMPProceedings paperhttp://www.ecsdl.org/vsearch/servlet/VerityServlet?KEY=ECSTF8&ONLINE=YES&smode=strresults&sort=rel&maxdisp=25&threshold=0&pjourn