Challenges in testing TSV-based 3D stacked ICs: test flows, test contents, and test access

Marinissen, Erik JanErik JanMarinissen2021-10-182021-10-182010-12https://imec-publications.be/handle/20.500.12860/17581Challenges in testing TSV-based 3D stacked ICs: test flows, test contents, and test accessProceedings paper