Reliability and failure modes of SnAgCu solder joints for PSGA packages

Ratchev, PetarPetarRatchevVandevelde, BartBartVandeveldeGonzalez, MarioMarioGonzalezDe Wolf, IngridIngridDe Wolf2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8062Reliability and failure modes of SnAgCu solder joints for PSGA packagesProceedings paper