Fine-pitch 3D System Integration and Advanced CMOS nodes: Technology and System Design Perspective

Milojevic, DragomirDragomirMilojevicSisto, GiulianoGiulianoSistoVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2022-07-122021-11-022022-07-042022-07-122021-02-220277-786XWOS:000672647800010https://imec-publications.be/handle/20.500.12860/37773Fine-pitch 3D System Integration and Advanced CMOS nodes: Technology and System Design PerspectiveProceedings paper10.1117/12.2584532978-1-5106-4062-7WOS:000672647800010Electrical & electronic engineering3D DTCO Partitioning