Lofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezGuo, WeiWeiGuoVan der Plas, GeertGeertVan der Plas2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25572Chip package interaction: A stress analysis on 3D IC's packagesProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7103096