Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C

Chanson, RomainRomainChansonZhang, LipingLipingZhangNaumove, SergeiSergeiNaumoveMankelevich, Yu.Yu.MankelevichTillocher, ThomasThomasTillocherLefaucheux, PhillipePhillipeLefaucheuxDussart, RemiRemiDussartDe Gendt, StefanStefanDe Gendtde Marneffe, Jean-FrancoisJean-Francoisde Marneffe2021-10-252021-10-2520182045-2322https://imec-publications.be/handle/20.500.12860/30391Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° CJournal articlehttps://www.nature.com/articles/s41598-018-20099-5