Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxation

Reiche, M.M.ReicheMoutanabbir, O.O.MoutanabbirHimcinschi, C.C.HimcinschiChristiansen, S.S.ChristiansenErfurth, E.E.ErfurthGoesele, U.U.GoeseleMantl, S.S.MantlBuca, D.D.BucaZhao, Q. T.Q. T.ZhaoLoo, RogerRogerLooNguyen, DuyDuyNguyenMuster, F.F.MusterPetzold, M.M.Petzold2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14364Strained silicon on wafer level by wafer bonding: materials processing, strain measurements and strain relaxationProceedings paper