A parylene temporary packaging technique for MEMS wafer handling

Wen, LiangongLiangongWenWouters, K.K.WoutersCeyssens, F.F.CeyssensWitvrouw, AnnAnnWitvrouwPuers, BobBobPuers2021-10-192021-10-1920111877-7058https://imec-publications.be/handle/20.500.12860/20147A parylene temporary packaging technique for MEMS wafer handlingJournal article