Jarboui, AhmedAhmedJarbouiCauwe, MaartenMaartenCauweVermeiren, FilipFilipVermeirenVerplancke, RikRikVerplanckeHamadi, KhemakhemKhemakhemHamadiVanfleteren, JanJanVanfleterenOp de Beeck, MaaikeMaaikeOp de Beeck2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22546Parylene-C for hermetic and flexible encapsulation of interconnects and electronic componentsOral presentation