Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging

Salahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezPodpod, ArnitaArnitaPodpodRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31712Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level PackagingProceedings paperhttps://ieeexplore.ieee.org/document/8546433