Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments

Op de Beeck, MaaikeMaaikeOp de BeeckJarboui, AhmedAhmedJarbouiCauwe, MaartenMaartenCauweDeclercq, HeidiHeidiDeclercqUytterhoeven, GrietGrietUytterhoevenCornelissen, MariaMariaCornelissenVanfleteren, JanJanVanfleterenVan Hoof, ChrisChrisVan Hoof2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22889Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environmentsProceedings paper