Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

Oechsner, RichardRichardOechsnerPfeffer, M.M.PfefferFrickinger, J.J.FrickingerSchellenberger, M.M.SchellenbergerRoeder, G.G.RoederPfitzner, L.L.PfitznerRyssel, H.H.RysselFritzsche, M.M.FritzscheKaushik, V.V.KaushikRenaud, D.D.RenaudDanel, A.A.DanelClaeys, CorCorClaeysBearda, TwanTwanBeardaLering, M.M.LeringGraef, M.M.GraefMurphy, B.B.MurphyWalther, H.H.WaltherHury, S.S.Hury2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12632Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sitesJournal article