Direct bonding of low temperature heterogeneous dielectrics

Iacovo, SerenaSerenaIacovoPeng, LanLanPengPhommahaxay, AlainAlainPhommahaxayInoue, FumihiroFumihiroInoueVerdonck, PatrickPatrickVerdonckKim, Soon-WookSoon-WookKimSleeckx, ErikErikSleeckxMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2022-04-042022-04-012022-04-0420190569-5503WOS:000503261500332https://imec-publications.be/handle/20.500.12860/39563Direct bonding of low temperature heterogeneous dielectricsProceedings paper10.1109/ECTC.2019.00-16978-1-7281-1498-9WOS:000503261500332THERMAL SILICONWAFERMECHANISM