RF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technology

Sun, XiaoXiaoSunSlabbekoorn, JohnJohnSlabbekoornVelenis, DimitriosDimitriosVelenisMiller, AndyAndyMillerVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34086RF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technologyProceedings paperhttps://www.conftool.net/eptc2019/index.php?page=browseSessions&print=yes&doprint=yes&form_session=166