Beyne, EricEricBeyneVan Hoof, RitaRitaVan HoofWebers, TomasTomasWebersRossi, S.S.RossiLechleiter, F.F.LechleiterDi Ianni, M.M.Di IanniOstmann, A.A.Ostmann2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4120High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)Proceedings paper