Luhn, OleOleLuhnVan Hoof, ChrisChrisVan HoofRuythooren, WouterWouterRuythoorenCelis, Jean-PierreJean-PierreCelis2021-10-182021-10-1820090013-4686https://imec-publications.be/handle/20.500.12860/15768Filling of microvia with an aspect ratio of 5 by copper electrodepositionJournal article