Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

Podpod, ArnitaArnitaPodpodDemeurisse, CarolineCarolineDemeurisseRebibis, Kenneth JuneKenneth JuneRebibisGerets, CarineCarineGeretsPhommahaxay, AlainAlainPhommahaxayCapuz, GiovanniGiovanniCapuzDuval, FabriceFabriceDuvalSleeckx, ErikErikSleeckxStruyf, HerbertHerbertStruyfMiller, AndyAndyMillerBeyne, EricEricBeyneBeyer, GeraldGeraldBeyer2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24393Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backsideProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028283