Bump pad design and its impact on the reliability of flip chip packages

Gonzalez, MarioMarioGonzalezLofrano, MelinaMelinaLofranoVanstreels, KrisKrisVanstreelsZahedmanesh, HoumanHoumanZahedmaneshBeyne, EricEricBeyne2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30785Bump pad design and its impact on the reliability of flip chip packagesMeeting abstract