Dobrovolska, TsvetinaTsvetinaDobrovolskaMack, MartinMartinMackLeyendecker, KlausKlausLeyendeckerMartin, KevinKevinMartinRadisic, AlexAlexRadisicShafahian, EhsanEhsanShafahianMudigere Krishne Gowda, PunithPunithMudigere Krishne GowdaDerakhshandeh, JaberJaberDerakhshandehStruyf, HerbertHerbertStruyf2026-03-312026-03-312025979-8-3315-3933-70569-5503https://imec-publications.be/handle/20.500.12860/58989The newly developed tin-indium (Sn-In) electrolyte enables the electrochemical deposition of eutectic and neareutectic Sn-In alloys containing 45-55 wt.% indium. The reflow process was successfully conducted at temperatures below 150∘C, approaching the eutectic melting point of Sn -In and remaining lower than the melting temperature of pure indium. Additionally, the results of the preliminary bonding tests are presented, demonstrating the potential of this electrolyte for lowtemperature assembly applications.engProceedings paper10.1109/ECTC51687.2025.00328WOS:001537918100316