Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

Krishtab, MikhailMikhailKrishtabde Marneffe, Jean-FrancoisJean-Francoisde MarneffeArmini, SilviaSilviaArminiMeersschaut, JohanJohanMeersschautBender, HugoHugoBenderWilson, ChrisChrisWilsonDe Gendt, StefanStefanDe Gendt2021-10-272021-10-2720190169-4332https://imec-publications.be/handle/20.500.12860/33334Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residuesJournal articlehttps://doi.org/10.1016/j.apsusc.2019.04.083