Multilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutions

Beyne, EricEricBeyne2021-10-162021-10-162005-04https://imec-publications.be/handle/20.500.12860/10097Multilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutionsProceedings paper