Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process

Vandevelde, BartBartVandeveldeDeweerdt, RafaelRafaelDeweerdtDuflos, FredericFredericDuflosGonzalez, MarioMarioGonzalezVanderstraeten, DanielDanielVanderstraetenBlansaer, EddyEddyBlansaerBrizar, GuyGuyBrizarGillon, RenaudRenaudGillon2021-10-182021-10-182009-10https://imec-publications.be/handle/20.500.12860/16432Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow processProceedings paper