Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package

Vandevelde, BartBartVandeveldeBeyne, EricEricBeyneVan Puymbroeck, JanJanVan PuymbroeckHeerman, M.M.Heerman2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3969Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) packageProceedings paper