Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Tsau, Yan WenYan WenTsauDe Messemaeker, JokeJokeDe MessemaekerSalahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezWitters, LiesbethLiesbethWittersZhang, BoyaoBoyaoZhangSeefeldt, MarcMarcSeefeldtBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2023-03-092023-01-092023-03-0920220026-2714WOS:000897681400006https://imec-publications.be/handle/20.500.12860/40952Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bondingJournal article10.1016/j.microrel.2022.114716WOS:000897681400006STRESS