Stoukatch, SergueiSergueiStoukatchWinters, ChristopheChristopheWintersTorfs, TomTomTorfsDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyneVan Hoof, ChrisChrisVan Hoof2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12953Double and triple stacked solder joint technology for further miniaturization of 3D-SIPProceedings paper