Standard SMT process for flip-chip assembly on FR4 substrate

Harris, S.S.HarrisPatra, G.G.PatraMainwaring, S.S.MainwaringSchols, G.G.ScholsMathelin, D.D.MathelinCorlatan, D.D.CorlatanRaedschelders, E.E.RaedscheldersDe Langhe, PascalPascalDe LangheDe Baets, JohanJohanDe BaetsVereeken, MariaMariaVereekenVan Calster, AndreAndreVan CalsterMorrell, MMMorrellHaley, C.C.HaleyOstman, A.A.Ostman2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5335Standard SMT process for flip-chip assembly on FR4 substrateProceedings paper