Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour

Heylen, NancyNancyHeylenLi, YunlongYunlongLiTravaly, YoussefYoussefTravalyVereecke, GuyGuyVereeckeVolders, HennyHennyVoldersTokei, ZsoltZsoltTokeiVersluijs, JankoJankoVersluijsRip, JensJensRipBeyer, GeraldGeraldBeyerFischer, PaulPaulFischerZhao, LarryLarryZhaoSantoro, GaetanoGaetanoSantoroNguyen, OlivierOlivierNguyenCockburn, AndrewAndrewCockburn2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13874Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviourMeeting abstract