Hybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bonding

Stankovic, StevanStevanStankovicRoelkens, GuntherGuntherRoelkensVan Thourhout, DriesDriesVan Thourhout2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14510Hybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bondingOral presentation