Backside analysis of ultra-thin film stacks in microelectronics technology using X-ray photoelectron spectroscopy

Hantschel, ThomasThomasHantschelDemeulemeester, CindyCindyDemeulemeesterSuderie, ArnaudArnaudSuderieLacave, ThomasThomasLacaveConard, ThierryThierryConardVandervorst, WilfriedWilfriedVandervorst2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15432Backside analysis of ultra-thin film stacks in microelectronics technology using X-ray photoelectron spectroscopyProceedings paper