Particle removal efficiency and damage analysis of patterned wafers in different solvents after megasonic cleaning

Halder, SandipSandipHalderBearda, TwanTwanBeardaKenis, KarineKarineKenisJanssens, TomTomJanssensLe, Quoc ToanQuoc ToanLeWostyn, KurtKurtWostynLeunissen, PeterPeterLeunissenMertens, PaulPaulMertens2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13835Particle removal efficiency and damage analysis of patterned wafers in different solvents after megasonic cleaningOral presentation