Iker, FrancoisFrancoisIkerSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanCotrin Teixeira, RicardoRicardoCotrin TeixeiraSoussan, PhilippePhilippeSoussanDe Moor, PietPietDe MoorBeyne, EricEricBeyneBaert, KrisKrisBaert2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/123343D Embedding and interconnection of ultra thin (<20um) silicon diesProceedings paper