Patterning of 25nm contact holes at 90nm pitch: combination of line/space double exposure immersion lithography and plasma-assisted shrink technology

de Marneffe, Jean-FrancoisJean-Francoisde MarneffeLazzarino, FredericFredericLazzarinoGoossens, DannyDannyGoossensVandervorst, AlainAlainVandervorstRichard, OlivierOlivierRichardShamiryan, DenisDenisShamiryanXu, KaidongKaidongXuTruffert, VincentVincentTruffertBoullart, WernerWernerBoullart2021-10-192021-10-1920110021-4922https://imec-publications.be/handle/20.500.12860/18788Patterning of 25nm contact holes at 90nm pitch: combination of line/space double exposure immersion lithography and plasma-assisted shrink technologyJournal article