Second level joint failures due to excessive warpage of advanced IC packages

Debecker, BjornBjornDebeckerVandevelde, BartBartVandeveldeWillems, GeertGeertWillemsAllaert, BartBartAllaert2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22232Second level joint failures due to excessive warpage of advanced IC packagesMeeting abstract