A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking

Miller, AndyAndyMillerHaensel, LeanderLeanderHaenselVandeweyer, TomTomVandeweyerBeyne, EricEricBeyneWiesiollek, MarkusMarkusWiesiollekEisenbach, HeikoHeikoEisenbachFilzen, MarcMarcFilzenWen, YouxianYouxianWenSood, SumantSumantSood2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25645A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stackingProceedings paperhttp://www.iwlpc.com/papers/presentations/Ng_Jenny_1.pdf