Influence of the processing method on the amount and development of voids in miniaturized interconnections

Dimcic, BiljanaBiljanaDimcicLabie, RietRietLabieZhang, WenqiWenqiZhangDe Wolf, IngridIngridDe WolfVerlinden, BertBertVerlinden2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17029Influence of the processing method on the amount and development of voids in miniaturized interconnectionsProceedings paper