Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

Beyne, SofieSofieBeyneCroes, KristofKristofCroesvan der Veen, MarleenMarleenvan der VeenVarela Pedreira, OlallaOlallaVarela PedreiraQi, Q.Q.QiDe Wolf, IngridIngridDe WolfTokei, ZsoltZsoltTokei2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27850Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurementsProceedings paperhttp://ieeexplore.ieee.org/document/7968946/