SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off

Dross, FredericFredericDrossMilhe, AurelienAurelienMilheRobbelein, JoJoRobbeleinGordon, IvanIvanGordonBouchard, Pierre-OlivierPierre-OlivierBouchardBeaucarne, GuyGuyBeaucarnePoortmans, JefJefPoortmans2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13676SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-offProceedings paper